Global leading embedded solution provider
0
%
QFN16-DIP-EVM
QFN16-DIP-EVM

BREAKOUT BOARD

Texas Instruments
Brand
Box
Packaging
Batch
226
Stock
Product specifications
TYPEDESCRIPTION
MfrTexas Instruments
Series-
PackageBox
Product StatusACTIVE
Number of Positions16
Proto Board TypeSMD to DIP
Package AcceptedQFN
Technical documentation
Product Overview
BREAKOUT BOARD
0.254193s